How to kiểm tra whether i
Phone 7 or i
Phone 7 Plus has intel LTE modem or / Vs Qualcomm LTE modem, with one of them being faster than other.

Bạn đang xem: Early iphone 7 teardowns: intel & qualcomm modems, tsmc soc, 2 to 3 gb of ram

We have already told you that both Apple’s i
Phone 7 và i
Phone 7 Plus feature hardware from two different manufacturers – namely Qualcomm & Intel – when it comes to lớn the LTE modem, & that’s unfortunate, because not all modems are created equal. I
Phone 7 units with a Qualcomm chip inside apparently perform slightly better than those with an hãng intel part.

This has been proven by a few tests now, and while we’re still not convinced that the difference in speed or workable range would be a big one, we know that some of you will wonder which chip you’re using right now.

Working out the answer khổng lồ that question is actually surprisingly easy. In fact, if you’re wondering whether Qualcomm or hãng intel is powering your LTE experience on your i
Phone 7 right now, the following is all you need to bởi to get a quick answer. Head on over to lớn the Settings app & select General > About > Legal > Regulatory. Here, at the đứng đầu of the screen, should be the model number we’re looking for in order to carry out a quick & dirty identification. 

Now if the model number shown here reads A1778 or A1784, then the i
Phone 7 or i
Phone 7 Plus in question is an AT&T or T-Mobile version making use of the Intel modem. If the model number is A1660 or A1661, however, then it’s going khổng lồ be a Sprint or Verizon variant with a Qualcomm modem. We told you it was easy.

As we say, though, we wouldn’t go looking for the answers here were it not for some idle curiosity. Changing i
Phones, & carriers, just because of the brand of LTE chip in use would be much too much for us to recommend. After all, no matter which LTE hardware is in your i
Phone, it’s always going khổng lồ be quick.

That’s what 4G is all about, after all.

You might also like to kiểm tra out:

You can follow us on Twitter, showroom us lớn your circle on Google+ or lượt thích our Facebook page khổng lồ keep yourself updated on all the latest from Microsoft, Google, Apple & the web.


Oliver Haslam has written about giải pháp công nghệ for nearly ten years. His work has been published in print at Macworld & online pretty much everywhere else. If it plugs in or has a battery, it"s fair game.

Today is launch date for Apple’s new i
Phone 7 models, and as is tradition every year, the teardowns have already begun. Both the Chipworks/Tech
Insights team và i
Fixit have completed their respective initial teardowns of the i
Phone 7 & 7 Plus, tearing part some of the first phones lớn go on sale. These teardowns are preliminary – there’s a lot of work left to vày in deciphering the many cryptic identification numbers of the various components – but right off the bat it confirms a few things about each of the phones.


We’ll start off with the Chipworks teardown of an i
Phone 7, which they have already earnestly begun identifying chips on. One of their immediate findings is that for the first time in a while, táo khuyết is using a non-Qualcomm modem. On Chipworks’ GSM phone, they have found an hãng sản xuất intel baseband processor with the model number PMB9943. They believe this khổng lồ be part of Intel’s XMM 7360 modem, which was announced back in 2015.


The XMM 7360 is a high-end LTE Advanced modem kiến thiết that offers up khổng lồ Category 10 performance (450 Mbps down). This is achieved in part through the use of 3x carrier aggregation, which allows the modem to lớn use up to 60Mhz of wireless spectrum. The modem does not support CDMA, và as the i
Fixit team has turned up a Qualcomm Snapdragon X12 (Cat 12) modem in their unit, táo apple is clearly using modems from multiple vendors. It’s not clear how this breakdown works – if hãng apple is using the Qualcomm modem in some GSM phones as well – but at a minimum the Qualcomm modem will have to be in all of the CDMA-capable models.

Xem thêm: Bộ Đề Minh Họa 2020 - Bộ Đề Minh Họa Thi Thpt Quốc Gia 2020

Meanwhile for Intel’s modem group, this is a significant win, as the company has not seen too many high-profile device wins in recent years. Though historically speaking, this is actually something of a return lớn form. The original i
Phone used a modem from the group’s predecessor, Infineon’s wireless unit, whom hãng sản xuất intel purchased in 2010.

Moving on, we have of course the A10 Fusion So
C. Chipworks has yet to lớn get a die shot in, but they have already confirmed that the So
C is produced by TSMC. This is presumably another 16nm Fin
C, but the Chipworks team will be working khổng lồ confirm that. So far there is no evidence lớn indicate that táo bị cắn dở is dual-sourcing So
Cs on the i
Phone 7 lượt thích they did the i
Phone 6s, but this is again preliminary information.



Given that hãng apple doesn’t get a major new manufacturing process lớn use this generation, I had been wondering if & how apple would instead compromise on die size, & we now have a rough answer. Chipworks estimates the A10 die to lớn be roughly 125mm2 in size. This is 20.5mm2 (~20%) larger than the A9 TSMC die. The good news for táo apple is that yields should be much better in năm nhâm thìn than they were in 2015, so chip manufacturing costs should be down, helping khổng lồ offset the higher costs of the larger chip. And while there are ways to improve performance without increasing the die size, any kind of significant improvement would have lớn entail a larger die, which is exactly what we’re seeing here. If nothing else, táo apple would need more room for the new high-efficiency CPU cores the cpu packs in.

Speaking of packing, Chipworks’ teardown also hints that the A10 may have been packaged using TSMC’s new Integrated fan Out (In
FO) technique, which is meant to allow for thinner cpu packages. In
FO saves space, in part, by eliminating the organic substrate that ngắn gọn xúc tích dies have traditionally been mounted on.


Lastly with the A10, Chipworks’ teardown of their i
Phone 7 confirms that it has 2GB of RAM, specifically Samsung LPDDR4. Besides confirming that the memory capacity on the i
Phone 7 hasn’t increased versus the i
Phone 6s, this is notable because i
Fixit has found something different with their i
Phone 7 Plus. In the case of the larger phone, there is 3GB of RAM. Táo khuyết has never before equipped the Plus with more memory than the base model, so this is a first. & while there has always been some performance stratification between the two phones due to the Plus model’s larger size – allowing better heat dissipation, và therefore slightly better performance – I wonder if this means we’re going to lớn see an increase in the stratification between the two phone models. If nothing else, I suspect this comes as a consequence of the Plus’s higher resolution screen: all other factors being held equal, the Plus needs a bit more RAM for its larger GPU frame buffers.

Update: The Chipworks crew has their die shot và floor plan back, so let's take a look.


As apple already disclosed the number of GPU clusters, there's not a whole lot left to doubt in terms of basic construction.The GPU cores, SRAM caches, và the performance CPU cores are all easy enough to lớn find, with the latter block now about 16mm2, versus 13mm2 in the A9. The big question here is where the two smaller, high-efficiency cores are. Chipworks postulates three thories: 1) They're in the same block as the high performance cores (and hence labeled as a quad core CPU), they're to lớn the left of the die, or they're lớn the bottom left of the die.

It is likely - but not guaranteed - that they're close lớn the high-performance cores. However both alternative locations do have pairs of identical blocks, which is what you'd be looking for in a secondary phối of CPU cores. So although those options are less likely, without additional information it's difficult to rule out those options entirely.

Finally, one interesting aspect of the Chipworks report is that they unexpectedly found a third audio amplifier. Chipworks was expecting khổng lồ find two – one for each of the speakers – but came up with a third. The firm believes that the third amp may be for headphones, which in turn would mean that táo bị cắn dở has significantly revised the Lightning port specification for the i
Phone 7. Previously Lightning has only carried digital audio, which doesn’t require an amp in the phone itself. In the initial i
Phone 7 announcement I had speculated that apple put the DAC (and amp) inside their 3.5mm adapter – which would be consistent with how Lightning has worked over the last 4 years – but this casts doubt on that idea. If táo khuyết has revised the specification lớn allow analog audio over the port, then this greatly simplifies how headphones & adapters will work. But it also would raise a number of questions about peripheral compatibility, especially what happens if you plug something like the Lightning Ear
Pods into an older device lượt thích the i
Phone 5s.


On that note, the Chipworks và i
Fixit teardowns also show us what’s gone in the place of the now-absent tai nghe jack: táo bị cắn dở has placed a taptic engine (linear actuator) for the solid state trang chủ button, & an unusual plastic bumper.


Wrapping things up, Chipworks’ reports that they already have the A10 So
C in their lab for further work, including confirming the manufacturing process and, of course, a die shot. The latter should prove to lớn be very interesting, as it will be the first look we get at Apple’s new high-efficiency CPU cores. And in the meantime on our kết thúc we also have our i
Phone samples in-house, so we’re diligently working on putting together a review for later this month. So be sure to lớn stay tuned for that.